INFLUENCE OF SUBSTRATE TEMPERATURE ON THE GROWTH OF Ti₄₅Ni₅₅ FILMS ON Ni SURFACES

Anh-Vu Pham; Trong-Linh Nguyen; Van-Ha Nguyen; Van-Thoai Nguyen; Quang-Chung Nguyen

Anh-Vu Pham Hung Yen University of Technology and Education
Trong-Linh Nguyen Hung Yen University of Technology and Education
Van-Ha Nguyen Hung Yen University of Technology and Education
Van-Thoai Nguyen Hung Yen University of Technology and Education
Quang-Chung Nguyen Hung Yen University of Technology and Education

Abstract

Molecular dynamics simulations were employed to examine the influence of substrate temperature on the growth behavior of Ti₄₅Ni₅₅ thin films on stepped Ni(001) surfaces. Deposition cases were performed over a temperature range from 300 K to 1100 K under constant deposition energy and incident angle conditions. The results reveal that elevated temperatures facilitate interfacial intermixing, induce structural disorder, and lead to film amorphization. Furthermore, the presence of stepped surfaces significantly enhances atomic diffusion and mixing at the interface. These atomic-scale insights highlight the critical role of temperature in driving film evolution and support the potential formation of amorphous TiNi coatings.

References

Ryu, H., Lee, Z. F., Kim, J. Y., Choi, S., & Sim, G. D., Cyclic stability in NiTi and NiTiCu thin films: Role of precipitates in low-and high-cycle regimes. Scripta Materialia, 2025, 250, 116189.

Shukla, U., & Garg, K., Journey of smart material from composite to shape memory alloy (SMA), characterization and their applications-A review. Smart Materials in Medicine, 2023, 4, pp. 227-242.

Deng, Z., Huang, K., Yin, H., & Sun, Q., Temperature-dependent mechanical properties and elastocaloric effects of multiphase nanocrystalline NiTi alloys. Journal of Alloys and Compounds,2023, 938, 168547.

Vitushinsky, R., Schmitz, S., & Ludwig, A., Bistable thin-film shape memory actuators for applications in tactile displays. Journal of Microelectromechanical Systems, 2008, 18(1), pp. 186-194.

Makino, E., Uenoyama, M., & Shibata, T., Flash evaporation of TiNi shape memory thin film for microactuators. Sensors and Actuators A: Physical, 1998, 71(3), pp. 187-192.

Adams, T. M., Kirkpatrick, S. R., Wang, Z., & Siahmakoun, A., NiTi shape memory alloy thin films deposited by co-evaporation. Materials Letters, 2005, 59(10), pp. 1161-1164.

Zayzoune, S., Mazroui, M., Boughaleb, Y., & Kara, A., Anomalous behaviour of the diffusion coefficient in interacting adsorbates. Surface science, 2009, 603(20), pp. 3126-3130.

Weng, Z., Zhang, F., Xu, C., & Zhou, J.,. The effect of incident energy, incident angle and substrate temperature on surface morphology and atomic distribution of NiTi films. Materials & Design, 2020, 187, 108350.

Ichou, M. A., Mes-adi, H., Saadouni, K., & Mazroui, M. H., Deposition of TiNi thin films on Ni (001) substrate using molecular dynamics simulation. Physica B: Condensed Matter, 2023, 671, 415365.

Bai, X., Cai, Q., Xie, W., Zeng, Y., Chu, C., & Zhang, X., In-situ crystalline TiNi thin films deposited by HiPIMS at a low substrate temperature. Surface and Coatings Technology, 2023, 455, 129196.

Zhu, G., Sun, J., Zhang, L., & Gan, Z., Molecular dynamics simulation of temperature effects on deposition of Cu film on Si by magnetron sputtering. Journal of Crystal Growth, 2018, 492, pp. 60-66.

Pham, A. V., Fang, T. H., Tran, A. S., & Chen, T. H., Effect of annealing and deposition of Cu atoms on Ni trench to interface formation and growth mechanisms of Cu coating. Superlattices and Microstructures, 2020, 139, 106402.

Hong, Z. H., Hwang, S. F., & Fang, T. H., The deposition of Fe or Co clusters on Cu substrate by molecular dynamic simulation. Surface science, 2011, 605(1-2), pp. 46-53.

Lablali, M., Mes-Adi, H., Eddiai, A., Abderrafi, K., & Mazroui, M., Cu thin film growth on stepped Si substrate: Effects of incident energy and thermal annealing. Journal of Crystal Growth, 2024, 637, 127739.